Diode - pn Junction and Metal Semiconductor Contact
$99
ENROLL NOWCourse Overview
What You'll Learn
- This course can also be taken for academic credit as ECEA 5631, part of CU Boulder’s Master of Science in Electrical Engineering degree.
- At the end of this course learners will be able to: 1.
This course can also be taken for academic credit as ECEA 5631, part of CU Boulder’s Master of Science in Electrical Engineering degree. This course presents in-depth discussion and analysis of pn junction and metal-semiconductor contacts including equilibrium behavior, current and capacitance responses under bias, breakdown, non-rectifying behavior, and surface effect. You'll work through sophisticated analysis and application to electronic devices. At the end of this course learners will be able to: 1. Analyze pn junction at equilibrium and under bias, capacitance and current characteristics, and breakdown behavior 2. Analyze metal-semiconductor contact at equilibrium and under bias, capacitance and current characteristics, non-rectifying contact and surface effects
Course FAQs
Is this an accredited online course?
Accreditation for 'Diode - pn Junction and Metal Semiconductor Contact' is determined by the provider, University of Colorado Boulder. For online college courses or degree programs, we strongly recommend you verify the accreditation status directly on the provider's website to ensure it meets your requirements.
Can this course be used for continuing education credits?
Many of the courses listed on our platform are suitable for professional continuing education. However, acceptance for credit varies by state and licensing board. Please confirm with your board and {course.provider} that this specific course qualifies.
How do I enroll in this online school program?
To enroll, click the 'ENROLL NOW' button on this page. You will be taken to the official page for 'Diode - pn Junction and Metal Semiconductor Contact' on the University of Colorado Boulder online class platform, where you can complete your registration.
